Description

Engineering-grade PC filament | High impact and heat resistance | Smooth, lustrous surface finish | 1kg spool

The Anycubic PC Filament is an engineering-grade polycarbonate filament designed for makers and engineers who need parts that go beyond what standard PLA or ABS can offer. Compatible with FDM printers fitted with a nozzle of 0.2 mm or above, it prints at 270–290°C with a heated bed of 100–120°C, and supports print speeds of 40–250 mm/s. With a heat deflection temperature of 110°C and strong mechanical properties — including a tensile strength of 65±6 MPa and an Izod impact strength of 30±12 kJ/m² — it is well suited to structural parts, functional components, automotive applications, electronic housings, and outdoor use. The filament also delivers smooth model surfaces with a translucent, lustrous quality. Note that active drying is required before printing: 80°C for 8–12 hours. Supplied on a 1kg reusable spool with intelligent identification chip support for compatible Anycubic printers.

Features

  • Engineering-grade PC filament for structural, functional, and outdoor applications
  • Heat deflection temperature of 110°C — resists warping and deformation under prolonged heat
  • Izod impact strength of 30±12 kJ/m² (X-Y) for tough, crack-resistant parts
  • Tensile strength of 65±6 MPa and bending strength of 105±10 MPa
  • Smooth, translucent, and lustrous surface finish
  • Intelligent identification chip supported for compatible Anycubic printers
  • Reusable spool with threaded connection system to reduce filament entanglement
  • Active drying required before use: 80°C for 8–12 hours

Specifications

  • Colour: White (#FFFFFF)
  • Dry Out Before Use: Required
  • Drying Condition: 80 ℃, 8-12 h
  • ACE Compatibility: Compatible
  • Nozzle Size: Recommended 0.2 mm or above
  • Printing Temperature: 270-290 ℃
  • Heated Bed Temperature: 100-120 ℃
  • Recommended Printing Speed: 40-250 mm/s
  • Maximum Volume Speed (Flow Rate): 12 mm³/s
  • Density: 1.2 g/cm³
  • Melt Index: 15-20 g/10 min (270℃/1.2kg)
  • Melting Point Temperature: 230 ℃
  • Vicat Softening Temperature: 122 ℃
  • Heat Deflection Temperature (0.45MPa): 110 ℃
  • Young’s Modulus: 2550±100 MPa
  • Tensile Strength: 65±6 MPa
  • Elongation at Break: 9±4%
  • Bending Modulus: 2900±150 MPa
  • Bending Strength: 105±10 MPa
  • lzod lmpact Strength (X-Y): 30±12 kJ/m²
  • Tensile Strength (Z): 25±7 MPa
  • Filament Type: Engineering filaments
  • Recommend to Print: Structural parts, functional parts, automotive parts, outdoor use, electronic housing, artworks
  • Intelligent Identification: Supported
  • Reusable Filament Spool: Supported

What’s in the Box

  • Anycubic PC Filament 1kg – White x1
Additional information
Weight1390 g
Dimensions46 × 44 × 22 cm
Battery Type

warranty

None

color

White

memory

processor

dimm slots

form factor

memory form factor

memory generation

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